Senior Package Engineer
TypeFull-time job
LocationTaiwan
Posted7 hours ago
At NVIDIA, we are committed to delivering exceptional solutions in a wide range of sectors, and we are looking for engineers who share our passion and dedication to making a difference in the world through their inventions. As a Senior Package Engineer, you will work closely with SI, layout, and ASIC design teams to develop complex, top-of-the-line ASIC packages. You will be responsible for planning schedules, resolving costs, packaging, manufacturing, and electrical design issues.
What you'll be doing:
Leading the development of groundbreaking microelectronics packaging for Nvidia Networking Business Unit's future products
Collaborating with world-leading vendors to develop highly ambitious packaging solutions
Joining and leading task forces to investigate and support production excursions, failure analysis, and reliability issues
Failure investigations and production support for High volume products
What we need to see:
MSc or equivalent experience in Mechanical Engineering / Materials Engineering or similar
At least 5 years of experience with development of complex processes (warpage, heat, optics, Adhesives, etc).
Experience co-working with subcontractors and vendors
Vision and focus for projects and team
Curious and creative problem solver as well as organized and multi-tasker
Team oriented, able to move and motivate peers. Strong interpersonal skills (verbal and written)
High awareness of quality, manufacturability and project schedule
Ways to stand out of the crowd:
Proven record in packaging development
Background in semiconductor manufacturing processes and optical systems
Join us at NVIDIA, an equal-opportunity employer that values diversity and inclusion. We do not discriminate on the basis of race, religion, color, national origin, gender, sexual orientation, age, marital status, veteran status, or disability status. We are dedicated to providing reasonable accommodations and adjustments to applicants with disabilities throughout the recruitment process. If you require accommodations, please let us know and we will work with you to meet your needs. Apply now to be part of our world-class team and contribute to the future of computing!
Originally posted on Himalayas
What you'll be doing:
Leading the development of groundbreaking microelectronics packaging for Nvidia Networking Business Unit's future products
Collaborating with world-leading vendors to develop highly ambitious packaging solutions
Joining and leading task forces to investigate and support production excursions, failure analysis, and reliability issues
Failure investigations and production support for High volume products
What we need to see:
MSc or equivalent experience in Mechanical Engineering / Materials Engineering or similar
At least 5 years of experience with development of complex processes (warpage, heat, optics, Adhesives, etc).
Experience co-working with subcontractors and vendors
Vision and focus for projects and team
Curious and creative problem solver as well as organized and multi-tasker
Team oriented, able to move and motivate peers. Strong interpersonal skills (verbal and written)
High awareness of quality, manufacturability and project schedule
Ways to stand out of the crowd:
Proven record in packaging development
Background in semiconductor manufacturing processes and optical systems
Join us at NVIDIA, an equal-opportunity employer that values diversity and inclusion. We do not discriminate on the basis of race, religion, color, national origin, gender, sexual orientation, age, marital status, veteran status, or disability status. We are dedicated to providing reasonable accommodations and adjustments to applicants with disabilities throughout the recruitment process. If you require accommodations, please let us know and we will work with you to meet your needs. Apply now to be part of our world-class team and contribute to the future of computing!
Originally posted on Himalayas
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