High-Speed PCB & Enclosure Design

PROJECT BRIEF: HIGH-SPEED INDUSTRIAL SENSOR NODE MODULE (PCB LAYOUT & CNC ENCLOSURE)

I am building a compact, high-performance module that combines a 600 MHz ARM SoC
in a BGA-196 package with a 30W smart amplified RF transceiver node. I need two
tightly coordinated pieces of engineering work, which can be awarded as independent
contracts to separate specialists, or as a unified project to a full-stack engineer:

1. High-speed 4–6-layer PCB layout (Target Fixed-Price Budget: £800 - £1,600)
2. Precision CNC-machined enclosure in 6061-T6 aluminum (Target Fixed-Price Budget: £400 - £800)

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DISCIPLINE 1: PCB HARDWARE LAYOUT DESIGN
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The board must run cleanly at high clock rates, so signal integrity, temperature
control, and full EMI/EMC compliance are non-negotiable. Whether you prefer Altium
Designer, Allegro, or KiCad is up to you; I’ll adapt to the tool you’re most
productive in.

CRITICAL DETAILS:
- Board 1 Footprint Layout: Strict 65mm x 20mm spatial constraint footprint.
- Silicon Escape Routing: High-density automated routing for three (3) NXP
BGA-196 microprocessors positioned side-by-side horizontally.
- Component Connectivity: SMT Micro Friction Sockets (Mill-Max 8421 Series or equivalent)
must be integrated directly onto the top layer of Board 1 to facilitate solderless,
toolless sensor pin swaps.
- Trace Parameters: Expect differential pairs, 50-ohm single-ended controlled
impedance traces, and a stack-up that balances cost with performance. Continuous
ground plane shielding must isolate the analog front-end from digital clock noise.
- Deliverables: Native design file, Gerber/ODB++, BOM with accurate manufacturer
part numbers, Pick-and-Place Centroid coordinate files (CPL), impedance report,
and fabrication notes.

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DISCIPLINE 2: PRECISION ENCLOSURE DESIGN (CNC MACHINING)
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The enclosure has to protect the RF section, provide solid thermal paths, and still
keep weight down. I need machining strategy, 3-D CAD, and 2-D manufacturing
drawings that hit tight tolerance levels, call out surface finishes suitable for
Type II Satin Black Anodizing, and respect the weight budget.

CRITICAL DETAILS:
- Enclosure A Dimensions: External dimensions capped at 65mm x 20mm x 10mm.
Internal component pocket clearance must fit a strict 3.5mm component height profile,
shielded by a rigid 1.0mm bolt-down floor plate. The top tier must support a
hinged protective cover swinging on a rear axis, secured by a low-profile knurled
front thumb-screw latch. Cover must clear six sliding vertical-travel adjusters.
- Enclosure B Dimensions: A telescopic compression clamp adapting to object depths
spanning 35mm to 120mm. Relies on overlapping vertical tracks guided by dual hardened
steel rails, locked via a precision 0.5mm rachet track and quick-release detent plunger.
- Cavity Routing: Integrate an isolated slide-out battery drawer cartridge channel and
allow a 0.75mm clearance envelope on all clamping faces for fluorosilicone rubber shims.
- Deliverables: STEP/Parasolid model, fully dimensioned 2D engineering blueprints with
tolerances detailing thread tapping (M1.6, M2), CAM-ready files, material and finish specs.

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ACCEPTANCE & MILESTONE TERMS
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This project will be executed strictly on a Fixed-Price Milestone basis via Escrow.
I’ll sign off and release respective funds once the PCB layout passes a zero-error
ERC/DRC check, simulation plots show safe margins, and the enclosure drawings
machine cleanly in a test CAM pass.

If you are an expert who can own either side—or both—please submit your proposal,
state which discipline you are bidding on, and answer the attached screening questions.