Audio DSP Hardware Module Design
Budget / Salary$30–250
TypeFreelance project
LocationRemote
Posted1 hour ago
ENGINEERING WORK ORDER: REST ACOUSTICS PROJECT
Objective: PCB Layout (Gerber/BOM/CPL) and 3D Enclosure Design (STEP/STL) for a standalone I2S/SPDIF audio DSP hardware module.
Important Note on Firmware: The client's team will handle all firmware development, software configuration, and flashing. The hardware engineer is ONLY responsible for the physical PCB design, component routing, and 3D enclosure modeling.
1. TOPOLOGICAL MAP & DIMENSIONS (PCB LAYOUT)
PCB Dimensions: 70 mm x 70 mm (leaving a 5 mm internal tolerance for the enclosure).
PCB Specs: 1.6 mm thickness, standard FR-4, 2 layers (Top/Bottom).
Rear Edge (I/O Panel):
Center: USB-C Connector (Used for 5V power input AND data lines D+/D- routed directly to the MCU's native USB pins for firmware flashing).
Left: TOSLINK RX Connector (Optical Receiver).
Right: TOSLINK TX Connector (Optical Transmitter).
Top / Front Panel:
Top-Left Corner: Power Button (Latching push-button or slide switch to completely cut off system power).
Exact Center: Tactile SMD Button (Momentary switch) for mode switching and IR learning activation.
10 mm above center button: 1x SMD Blue LED.
Next to the LED: 1x IR Receiver module (e.g., TSOP38238 or VS1838B) facing upwards/frontwards to receive TV remote control signals.
2. WIRING DIAGRAM & MICROCOMPONENTS (PINOUT)
DSP Brain: ESP32-S3-WROOM-1 module (Must be a version with >= 8MB integrated Flash). Chosen for its native USB support, floating-point processing capabilities, and low cost.
Audio Transceiver: Cirrus Logic WM8804 (or TI DIX4192) for SPDIF-to-I2S conversion.
Audio Routing (I2S Bus):
TOSLINK RX port connects to the RXIN pin on the WM8804.
WM8804 communicates with the ESP32-S3 via I2S. Map standard pins: BCLK, LRCLK, DIN, DOUT.
TXOUT pin on the WM8804 connects to the TOSLINK TX port.
Control Routing (ESP32-S3 GPIOs):
Multifunction Button: Connect to GPIO 14 with a 10k Pull-Up resistor to 3.3V (active LOW).
Blue LED: Connect to GPIO 15 with a 330-ohm current-limiting resistor.
IR Receiver: Connect the data out pin to GPIO 16 (used to capture IR remote signals).
Power System: USB-C 5V VBUS routes through an LDO voltage regulator (e.g., AMS1117-3.3) to step down from 5V to 3.3V for the system. The main latching physical switch must be placed on the main power trace before the LDO to allow complete shutdown.
3. 3D STRUCTURAL & INDUSTRIAL DESIGN (ENCLOSURE)
External Dimensions: 80 mm (Width) x 80 mm (Depth) x 25 mm (Height).
Material Specs: ABS Plastic (2 mm wall thickness).
Color & Texture: Absolute Matte Black. Mold injection texture code equivalent to Mold-Tech MT-11010.
Closure Mechanism: Snap-Fit internal clips for the bottom lid. The bottom base must include 4 circular indentations for anti-slip silicone rubber feet. Underneath the two front rubber feet, include hidden screw holes for 2x M2 security screws.
Surface Finishes & Cutouts:
Rear Cutouts: Millimeter-precise, flush cutouts for the 2 TOSLINK ports and the USB-C port (no loose gaps).
Top Panel: "ReSt" logo centered and embossed (raised 0.5 mm).
Center Button: 15 mm diameter hole for the physical push-button, surrounded by a 1 mm thick translucent polycarbonate ring (light diffuser for the internal blue LED).
IR Window: A tiny, discreet window or thinned plastic area near the LED to allow IR signals to reach the internal IR receiver.
4. REQUIRED DELIVERABLES
Gerber Files: .ZIP package (RS-274X format) ready for JLCPCB or PCBWay manufacturing.
BOM File: Excel sheet with exact component list, including LCSC part numbers for automated assembly.
CPL File: Pick & Place file for robotic SMD assembly.
3D Models: STEP and STL files for both the top and bottom enclosure parts.
Objective: PCB Layout (Gerber/BOM/CPL) and 3D Enclosure Design (STEP/STL) for a standalone I2S/SPDIF audio DSP hardware module.
Important Note on Firmware: The client's team will handle all firmware development, software configuration, and flashing. The hardware engineer is ONLY responsible for the physical PCB design, component routing, and 3D enclosure modeling.
1. TOPOLOGICAL MAP & DIMENSIONS (PCB LAYOUT)
PCB Dimensions: 70 mm x 70 mm (leaving a 5 mm internal tolerance for the enclosure).
PCB Specs: 1.6 mm thickness, standard FR-4, 2 layers (Top/Bottom).
Rear Edge (I/O Panel):
Center: USB-C Connector (Used for 5V power input AND data lines D+/D- routed directly to the MCU's native USB pins for firmware flashing).
Left: TOSLINK RX Connector (Optical Receiver).
Right: TOSLINK TX Connector (Optical Transmitter).
Top / Front Panel:
Top-Left Corner: Power Button (Latching push-button or slide switch to completely cut off system power).
Exact Center: Tactile SMD Button (Momentary switch) for mode switching and IR learning activation.
10 mm above center button: 1x SMD Blue LED.
Next to the LED: 1x IR Receiver module (e.g., TSOP38238 or VS1838B) facing upwards/frontwards to receive TV remote control signals.
2. WIRING DIAGRAM & MICROCOMPONENTS (PINOUT)
DSP Brain: ESP32-S3-WROOM-1 module (Must be a version with >= 8MB integrated Flash). Chosen for its native USB support, floating-point processing capabilities, and low cost.
Audio Transceiver: Cirrus Logic WM8804 (or TI DIX4192) for SPDIF-to-I2S conversion.
Audio Routing (I2S Bus):
TOSLINK RX port connects to the RXIN pin on the WM8804.
WM8804 communicates with the ESP32-S3 via I2S. Map standard pins: BCLK, LRCLK, DIN, DOUT.
TXOUT pin on the WM8804 connects to the TOSLINK TX port.
Control Routing (ESP32-S3 GPIOs):
Multifunction Button: Connect to GPIO 14 with a 10k Pull-Up resistor to 3.3V (active LOW).
Blue LED: Connect to GPIO 15 with a 330-ohm current-limiting resistor.
IR Receiver: Connect the data out pin to GPIO 16 (used to capture IR remote signals).
Power System: USB-C 5V VBUS routes through an LDO voltage regulator (e.g., AMS1117-3.3) to step down from 5V to 3.3V for the system. The main latching physical switch must be placed on the main power trace before the LDO to allow complete shutdown.
3. 3D STRUCTURAL & INDUSTRIAL DESIGN (ENCLOSURE)
External Dimensions: 80 mm (Width) x 80 mm (Depth) x 25 mm (Height).
Material Specs: ABS Plastic (2 mm wall thickness).
Color & Texture: Absolute Matte Black. Mold injection texture code equivalent to Mold-Tech MT-11010.
Closure Mechanism: Snap-Fit internal clips for the bottom lid. The bottom base must include 4 circular indentations for anti-slip silicone rubber feet. Underneath the two front rubber feet, include hidden screw holes for 2x M2 security screws.
Surface Finishes & Cutouts:
Rear Cutouts: Millimeter-precise, flush cutouts for the 2 TOSLINK ports and the USB-C port (no loose gaps).
Top Panel: "ReSt" logo centered and embossed (raised 0.5 mm).
Center Button: 15 mm diameter hole for the physical push-button, surrounded by a 1 mm thick translucent polycarbonate ring (light diffuser for the internal blue LED).
IR Window: A tiny, discreet window or thinned plastic area near the LED to allow IR signals to reach the internal IR receiver.
4. REQUIRED DELIVERABLES
Gerber Files: .ZIP package (RS-274X format) ready for JLCPCB or PCBWay manufacturing.
BOM File: Excel sheet with exact component list, including LCSC part numbers for automated assembly.
CPL File: Pick & Place file for robotic SMD assembly.
3D Models: STEP and STL files for both the top and bottom enclosure parts.
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