Altium RF PCB Design

I need an experienced Altium RF PCB designer for TWO related AGC modules (shared libraries/rules where possible):

1) Full Altium schematic for each board (from our frozen RF packages)
2) RF PCB layout for each board
3) Fab-ready outputs for each (Gerbers, stackup, BOM, assembly drawings)

Architecture/BOM already frozen. Job is capture + RF-aware layout only — do not re-architect.

PRODUCT 1 — UHF AGC (first priority)
- Band: 220–520 MHz
- Pin −90…−60 dBm → Pout −25 dBm nominal (−30…−20 window)
- 5 V, Idd 140 mA typ / 170 mA max
- Size: 25×25 mm, castellated, no SMA
- Chain: RLM-33+ → LC BPF → 3× GALI-39+ → HMC1119 → −20 dB tap
- Detector/AGC: AD8317 + STM32G031 (SPI to HMC1119)
- Stack: 4-layer RF (e.g. RO4350/hybrid — propose and justify)

PRODUCT 2 — C-band AGC (SAPTECH-AGC-003)
- Band: 4.4–5.0 GHz
- Pin −80…−60 dBm → Pout −25 dBm nominal (−30…−20 window)
- 5 V, Idd 200 mA typ / 230 mA max
- Size: ~35×35 mm SMT module (castellated / agreed edge launch; no SMA preferred)
- Chain: RLM-63-2W+ → 3× Qorvo QPL9503 → HMC1119 → −20 dB tap
- Detector/AGC: AD8317 + STM32G031 (same digital AGC pattern)
- Stack: Rogers RO4003C / RO4350 class 4-layer — propose and justify
- Do NOT use: HMC637-as-LNA, PE4312, GALI-84+ as required stage

SHARED
- 50 Ω RF routing, via fencing/keepouts, proper RF bias/decoupling
- Native Altium source (not Gerbers-only; not EasyEDA-only)
- One designer for both boards preferred

DELIVERABLES (per board)
- .SchDoc / .PcbDoc + libraries, PDF schematic
- Gerbers + drill + fab notes + controlled-impedance stackup
- Assembly drawing + BOM with MPNs
- DRC/ERC clean + short RF layout notes

MUST-HAVE
- Real RF board portfolio (photos/Gerbers), not only IoT/Arduino/Wi-Fi
- Discrete RF chain experience; ideally UHF and/or 4–6 GHz
- Impedance-controlled multilayer Altium

PROCESS
1) Paid screen task first (small fixed fee, 3–5 days) on UHF only: stackup + 50 Ω width; floorplan on 25×25; draft castellation map. Paid even if we stop.
2) Milestones: UHF schematic → UHF layout → C-band schematic → C-band layout → both Gerber packages
3) Milestone payments on acceptance
4) NDA + IP to client before full packages shared
5) Our RF engineer reviews PDF/ZIP exports

OUT OF SCOPE: architecture changes, firmware coding, buying parts, contacting our end customer.

TO APPLY: 2–3 RF board examples (band+year), Altium version, approach + timeline for both boards, start date. Discuss commercial terms privately after shortlisting — do not put a price in the public proposal text.